Gold Plating

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Gold plating is a surface treatment technology with excellent conductivity, corrosion resistance, and biocompatibility. It is widely used in semiconductor, satellite, and medical applications where high reliability is required. This article explains its unique functional benefits and key selection criteria for different applications.

Basic Properties of Gold Plating

Gold is chosen for harsh environments because of its unique physical and chemical properties. The following benefits help maintain long-term performance and improve yield.

  • Conductivity: Gold offers high electrical conductivity, surpassed only by silver and copper, helping minimize signal loss.
  • Corrosion Resistance: Gold resists oxidation and corrosion, helping prevent increases in contact resistance over the long term.
  • Biocompatibility: Gold is generally considered non-toxic to the human body and suitable for use in medical applications.
  • Solderability: Because gold does not form a surface oxide, it provides high wettability and helps ensure good solderability and joint reliability.
  • Heat Resistance: Gold maintains stable properties even at high temperatures, making it suitable for space and industrial applications.

Main Applications and Industries Served

This section explains how gold plating meets the demanding requirements of each industry.

Semiconductor Packages

When applied to bonding pads and lead frames, gold plating improves wire bond reliability. Coating thickness uniformity and purity directly affect yield, and variations can lead to bonding defects, making precise control of both essential.

Satellite Antennas

Gold plating is sometimes used in space equipment such as satellite antennas, particularly on areas requiring conductivity, corrosion resistance, and surface stability. At high frequencies, the skin effect makes surface conductivity a key factor in communication performance. Because gold maintains conductivity without oxidizing, it is well suited to space environments involving vacuum and extreme temperature changes.

Medical Connectors

For medical devices that come into contact with the human body, biological safety must be evaluated based on the contact site and duration of contact, and stable electrical connections must also be maintained. Gold plating resists wear from frequent mating cycles and maintains low contact resistance over the long term. During design, the plating process must be selected with applicable biological safety requirements under the ISO 10993 series and other international standards in mind.

Types of Gold Plating and Selection Guidelines

The appropriate specifications should be selected based on durability and cost requirements.

Plating Type Typical Thickness Properties and Example Applications
Gold flash Approx. 1.2 to less than 3.9 μin (0.03 to less than 0.1 μm) Offers excellent corrosion resistance and improves appearance. For exterior surfaces of connectors.
Thick gold 20 μin or more (0.5 μm or more) Offers high wear resistance and bonding reliability. For medical-device terminals.
Hard gold (cobalt-hardened) 20–79 μin (0.5–2 μm) Offers excellent hardness and wear resistance. For connectors subject to frequent sliding contact.
Soft gold (high purity) 20–118 μin (0.5–3 μm) Ductile and suitable for semiconductor wire bonding.

It is important to weigh the intended application, required properties, and cost and select the appropriate plating type.

Quality and Technical Requirements for Plating

Achieving reliable plating results requires proper surface preparation. Typically, a nickel barrier layer is formed to prevent metal diffusion from the substrate and improve adhesion. Requirements for coating thickness uniformity and purity vary by application. Particularly stringent standards apply to semiconductor applications because purity control directly affects yield.

Key Points When Requesting Plating Services

Compile the following information to communicate specifications accurately and ensure quality.

  • Specify the substrate material and any underlayer material, such as copper, nickel, or aluminum
  • Specify the required coating thickness, purity, and hardness
  • Provide details of the operating environment (temperature, wear, contact frequency, etc.)
  • Confirm the applicable standards for medical or space applications and whether the plating must be suitable for wire bonding

Beyond confirming whether prospective companies can perform the requested plating, it is important to identify companies with rigorous purity control and expertise in surface preparation. If you are looking for an outsourcing partner with proven technical capabilities, refer to “3 Recommended Functional Plating Shops by Industry and Component Type.”

3 Recommended
Functional Plating Services
by Industry
and Component Type
For
Semiconductor Components
“We need a shop for difficult plating others declined.”
Mitsuya
Japan, est. 1931
image-Mitsuya
Precious Metal Plating
for Micro Components
Mitsuya supports uniform precious metal plating on parts down to 0.1 mm in diameter. This can help improve precision and durability in semiconductor inspection equipment.
High-Adhesion Plating
for Tips and Contacts
Mitsuya has developed an in-house process for titanium and tungsten that does not require heat treatment. It can support high-adhesion plating on pin and card contact areas.
Support for New Product Development
Engineers can consult Mitsuya before semiconductor IC specifications are finalized and verify performance through prototypes. This can help reduce development risk and rework costs.
Industries Served
  • Electronics and Telecommunications
  • Semiconductor Inspection Equipment
  • Space Development
and More
For
Automotive Components
“We need 10 million parts delivered on time, every time.”
Greystone
U.S., est. 1932
image-Greystone
Consistent Quality and
Lead Times at Volume
Greystone has an annual mass-production record of 130 million automotive parts*1 through machining and plating.
Single-Source Support from Processing through Plating
Machining and plating are completed within the same group. Fewer delays between processes can help reduce costs.
Quality Standards
Automakers Trust
All U.S. locations are IATF 16949 certified, with plating process control that meets OEM quality standards.
Industries Served
  • Automotive
  • Firearms
and More
For
Aircraft
Components

“Nadcap is required. We need proven certification experience.”
Anoplate
U.S., est. 1960
image-Anoplate
Smoother Approval
from Major Primes
An approved supplier to Boeing, Lockheed Martin, and others, with more than 80 Nadcap-accredited processes.
Aerospace & Defense Work on a Certification-First Basis
Proven across a wide range of mission-critical components, including missiles and fighter aircraft.
Meets Defense Standards, Even the Strictest
Its cadmium-replacement zinc-nickel plating won a 2020 Secretary of Defense Environmental Award and has been used on the F-35*2.
Industries Served
  • Aerospace and Defense
  • Medical Devices
and More
*1 Based on information listed on each company’s official website as of April 20, 2026.
*2 Source: Anoplate official website https://www.anoplate.com/news-and-events/zinc-nickel-plating-highlights-2020-secretary-of-defense-environmental-award/