A wide range of surface treatment processes is available. The appropriate process must be selected based on the substrate material, operating environment, and required functional properties.
Plating methods are broadly divided into electroplating, which uses an external power source, and electroless plating, which uses a reducing agent; the two differ in how electrons are supplied.
The following sections introduce the main plating processes.
It offers excellent conductivity and corrosion resistance. It can be applied using either electroplating or electroless plating and provides reliable performance even with a thin coating. It is widely used in connectors and medical devices, but its material cost is relatively high because gold is a precious metal.
Because no external current is required, electroless nickel plating can produce a uniform coating thickness even on complex-shaped parts. It offers excellent hardness and wear resistance, and its properties can be further enhanced through heat treatment, making it well suited for aerospace and precision equipment applications.
| Plating Type | Method | Main Properties | Typical Applications | Relative Cost |
|---|---|---|---|---|
| Gold plating | Electroplating / electroless plating | Conductivity and corrosion resistance | Electronic components | High |
| Electroless nickel | Electroless plating | Uniform coating thickness and wear resistance | Aerospace | Medium |
| Hard chrome plating | Electroplating | High hardness and low friction | Shafts | Medium |
| Zinc plating | Electroplating | Sacrificial corrosion protection | Automotive components | Low |
| Silver plating | Electroplating / electroless plating | High conductivity | Switches | High |
| Tin plating | Electroplating | Solderability | Semiconductor devices | Low |
Electroplating is limited to conductive substrates and tends to produce variations in coating thickness, but is well suited for high-volume production.
Electroless plating can sometimes be applied to non-conductive substrates through pretreatment and catalyst activation, making it relatively easy to achieve a uniform coating even on complex shapes.
Based on the required properties, the following plating processes are recommended.
For rigorous quality control, specifications should be based on the following standards.
They are classified by coating thickness and other criteria under MIL and ASTM standards.
Gold plating is chemically stable and maintains high corrosion resistance.